Modular heat dissipation structure and LED lighting device
US11085628B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2020 |
| Grant date | Aug 10, 2021 |
| Priority date | — |
| Expiry date | Dec 4, 2040 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF21Y2115/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed are a modular heat dissipation structure and an LED lighting device. The modular heat dissipation structure includes a power box configured to accommodate and dissipate a power supply; and a heat sink configured to dissipate a light source; where the heat sink includes a first overlap portion, the power box includes a second overlap portion, the first overlap portion is provided on a side of the heat sink opposite to the second overlap portion and is provided corresponding to the second overlap portion, and the first overlap portion is overlapped above the second overlap portion. The LED lighting device includes the above-mentioned modular heat dissipation structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.