Method for assembling force sensor, involves applying sense die adhesive to place, where sense die material is removed
US11085837B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2019 |
| Grant date | Aug 10, 2021 |
| Priority date | — |
| Expiry date | Oct 9, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L9/0054
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A force sensor may comprise a sense die comprising a top part and a bottom part. Generally, the top part may comprise a first surface and a second surface, and the bottom part may comprise a first surface for direct contact with a substrate. Typically, the bottom part may be formed by removing a portion of the material of the sense die around the edges of a first face of the sense die. Typically, adhesive may replace the portion of the sense die material removed from the edges of the first face of the sense die. Thus, the adhesive may secure the first surface of the bottom part of the sense die directly to the substrate without serving as an interface between the bottom part of the sense die and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.