Micromechanical sensor device with integrated housing seal, micromechanical sensor assembly, and corresponding manufacturing method

US11085846B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Cristian Nagel · Reutlingen, DE
• Frederik Ante · Stuttgart, DE
• Sebastian Schuler-Watkins · Herrenberg, DE
• Timo Lindemann · Reutlingen, DE

Key dates

• Filing date: Jan 30, 2018
• Grant date: Aug 10, 2021
• Expiry date: Jul 23, 2038

Classification

• Technology area (CPC G): Physics
• CPC primary: G01L19/147
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A micromechanical sensor device is described that includes an integrated housing seal, a micromechanical sensor assembly, and a corresponding manufacturing method. The micromechanical sensor device with an integrated housing seal is equipped with a micromechanical sensor chip that includes an upper side and a lower side, a sensor area that may be brought into contact with an environmental medium being provided on or at the upper side, and is equipped with at least one circumferential trench, open toward the upper side, that is provided in the periphery of the sensor area and that is at least partly filled with a sealing medium for sealing a corresponding area of a housing to be mounted thereon.