Laser microdissection method and laser microdissection systems
US11085855B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2017 |
| Grant date | Aug 10, 2021 |
| Priority date | — |
| Expiry date | Jun 15, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2035/0491
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for performing a laser microdissection for cutting a dissectate from a specimen using a laser includes the step of providing the specimen in a light path of an illumination system. The specimen is illuminated by the illumination system. A detector detects light emanating from the specimen. The light detected by the detector is analyzed. It is determined, based on the analysis of the light detected by the detector, whether a receptacle for collecting the dissectate is disposed in a predetermined collection position, at which the dissectate is to be collected in the receptacle after it is cut from the specimen. Laser cutting of the dissectate from the specimen is initiated based on it having been determined that the receptacle is in the predetermined collection position.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.