Patent · US Active

Lens-less laser micro-package assembly

US11086088B2 · kind B2 · utility

8Cited by

1References

28Claims

0Family size

Assignee

II-VI DELAWARE, INC. · US

Inventors

Bernd Huebner · Santa Clara, US
Tsurugi Sudo · Pasadena, US
Shiyun Lin · San Diego, US

Key dates

Filing date	Aug 29, 2019
Grant date	Aug 10, 2021
Priority date	—
Expiry date	Feb 3, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH01S5/0237
WIPO fieldOptics
WIPO sectorInstruments

Abstract

An optoelectronic assembly may include a photonic integrated circuit (PIC) with a top surface and a laser with a top surface and a bottom surface. The optoelectronic assembly may also include a housing configured to cooperate with the PIC to one or both of house and support one or more components. The housing may include a PIC mount including a first surface to interface with the top surface of the PIC, and a laser mount including a second surface to interface with the top or bottom surface of the laser. The first surface and the second surface may be parallel to each other.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.