Electronic component, electronic apparatus, and method for manufacturing electronic component
US11087909B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2018 |
| Grant date | Aug 10, 2021 |
| Priority date | — |
| Expiry date | May 31, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In an embodiment, an electronic component includes: an insulator part 10 of rectangular solid shape; a coil element 32 provided inside the insulator part 10; bottom electrodes 40 provided on a bottom face 14 of the insulator part 10 and electrically connected to the coil element 32; a plating layer 62 provided in a manner overlapping each bottom electrode 40 so that its end 64 on the bottom face 14 is away from the end 42 of the bottom electrode 40; and a plating layer 60 which is arranged between the bottom electrode 40 and the plating layer 62 and overlaps the bottom electrode 40, and which is constituted by a metal having lower solder wettability and higher melting point than those of the plating layer 62. The electronic component can suppress generation of cracking in the insulator part.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.