Patent · US Active

Supplementary tool for chip transfer device with removal tool and turning tool

US11088013B2 · kind B2 · utility

0Cited by

4References

6Claims

0Family size

Assignee

ASM ASSEMBLY SYSTEMS GMBH & CO. KG · DE

Inventors

Sebastian Lohmeier · Munich, DE
Thomas Rossmann · Laichingen, DE
Michele Trigiani · Munich, DE

Key dates

Filing date	Oct 18, 2018
Grant date	Aug 10, 2021
Priority date	—
Expiry date	Jul 24, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/68707
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device for transferring chips from a wafer to a placement head of an automatic placement machine. The device includes a removal tool rotatable about a first axis of rotation (i) for the removing of singulated chips from the wafer, (ii) for turning the chips to provide them as FCOB chips at a first collection position, and (iii) for transferring, at a common transfer position, the chips to a turning tool rotatable about a second axis of rotation; and the rotatable turning tool (i) for receiving of chips from the removal tool, and (ii) for again turning the received chips, in order to provide them as COB chips at a second collection position. The removal tool has a plurality of first grippers, which are arranged protruding radially from the first axis of rotation in a first plane. The turning tool has a plurality of second grippers, which are arranged radially protruding from the second axis of rotation in a second plane. At least one rotatable tool of the removal tool and the turning tool has a first interface, at which a supplementary tool with a plurality of further grippers can be mounted, which are arranged radially protruding from a center axis in a further plane. The first i…

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.