Ceramic package opening, heat sink, vias coupled to conductive pad
US11088047B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 5, 2019 |
| Grant date | Aug 10, 2021 |
| Priority date | — |
| Expiry date | Feb 5, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A hermetic ceramic package for high current signals includes a substrate made of a plurality of ceramic green sheets that form an upper body portion having an upper surface and a lower body portion having a lower surface and an intermediate surface between the upper surface and the lower surface. A first conductive plate is formed on the intermediate surface and a first plurality of conductive pad vias are formed in the lower body portion, extending from the first conductive plate to the lower surface of the lower body portion. A heat sink if coupled to the lower surface of the lower body portion and a first conductive pad also coupled to the lower surface such that the first conductive pad is electrically coupled to the first plurality of conductive pad vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.