Package module including a plurality of electronic components and semiconductor chip(s) embedded in a single package
US11088060B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2019 |
| Grant date | Aug 10, 2021 |
| Priority date | — |
| Expiry date | Nov 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package module includes a core structure including a dummy member, one or more electronic components disposed around the dummy member, and an insulating material covering at least a portion of each of the dummy member and the electronic components, the core structure including a first penetration hole passing through the dummy member and the insulating material, a semiconductor chip disposed in the first penetration hole and having an active surface on which a connection pad is disposed and an inactive surface, an encapsulant covering at least a portion of each of the core structure and the semiconductor chip and filling at least a portion of the first penetration hole, and a connection structure disposed on the core structure and the active surface and including a redistribution layer electrically connected to the electronic components and the connection pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.