Patent · US Active

Layout structures with multiple fingers of multiple lengths

US11088075B2 · kind B2 · utility

0Cited by

4References

20Claims

0Family size

Assignee

GLOBALFOUNDRIES U.S. Inc. · US

Inventors

Souvick Mitra · South Burlington, US
Rainer Thoma · South Burlington, US
Harsh Shah · Pompano Beach, US
Anindya Nath · Butlers Corners, US
Robert J. Gauthier, JR. · Williston, US

Key dates

Filing date	Nov 1, 2019
Grant date	Aug 10, 2021
Priority date	—
Expiry date	Dec 13, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH10D30/6219
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Back-end-of-line layout structures and methods of forming a back-end-of-line layout structure. A metallization level includes a plurality of interconnects positioned over a plurality of active device regions. The plurality of interconnects have a triangular-shaped layout and a plurality of lengths within the triangular-shaped layout.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.