Chip package structure including ring-like structure and method for forming the same
US11088108B2 · kind B2 · utility
1Cited by
10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2019 |
| Grant date | Aug 10, 2021 |
| Priority date | — |
| Expiry date | Aug 13, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/37001
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for forming a chip package structure is provided. The method includes forming a first conductive bump and a first ring-like structure over a chip. The first ring-like structure surrounds the first conductive bump, the first ring-like structure and the first conductive bump are made of a same first material, the chip includes an interconnect structure, and the first ring-like structure is electrically insulated from the interconnect structure and the first conductive bump. The method includes bonding the chip to a substrate through the first conductive bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.