Methods and devices for fabricating and assembling printable semiconductor elements
US11088268B2 · kind B2 · utility
0Cited by
241References
17Claims
0Family size
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Inventors
Key dates
| Filing date | Jun 21, 2019 |
| Grant date | Aug 10, 2021 |
| Priority date | — |
| Expiry date | Jul 24, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/724
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.