Vertical coupling structure for antenna feeds
US11088453B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 10, 2020 |
| Grant date | Aug 10, 2021 |
| Priority date | — |
| Expiry date | Apr 10, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10098
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Technologies directed to vertical coupling structures for antenna feeds of phased array antennas are described. One circuit board includes a first layer with a first portion of a RF coupling structure, a second layer with a second portion of the RF coupling structure, and a first insulation layer located between the first layer and the second layer. The RF coupling structure is configured to electromagnetically couple a first conductive trace on the first layer and a second conductive trace on the second layer at RF frequencies. The circuit board also includes a third layer with a first antenna element and a second insulation layer located between the third layer and the first layer, the second insulation layer including a first via through which the first antenna element is coupled to the first conductive trace.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.