Remote communication and powered sensing/control/identification devices using high temperature compatible semiconductor materials
US11089389B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2019 |
| Grant date | Aug 10, 2021 |
| Priority date | — |
| Expiry date | Nov 19, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04W84/18
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A system includes a network of a plurality of sensing/control/identification devices distributed throughout a machine, each of the sensing/control/identification devices associated with at least one sub-system component of the machine and operable to communicate through a plurality of electromagnetic signals. Shielding surrounds at least one of the sensing/control/identification devices to contain the electromagnetic signals proximate to the at least one sub-system component. A communication path is integrally formed in a component of the machine to route a portion of the electromagnetic signals through the component and a remote processing unit operable to communicate with the network of the sensing/control/identification devices through the electromagnetic signals, wherein at least a portion of the sensing/control/identification devices comprise a wide band gap semiconductor device and wherein at least a portion of the sensing/control/identification devices comprise an on-chip antenna.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.