Integrated circuit / printed circuit board assembly and method of manufacture
US11089671B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2019 |
| Grant date | Aug 10, 2021 |
| Priority date | — |
| Expiry date | Jan 20, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10416
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integrated circuit/printed circuit board (IC-PCB) assembly comprises a PCB and a heatsink plate. The PCB has a first side including a first patterned conductive layer with one or more thermal pads onto which one or more heat slugs of one or more ICs mount, and a second, opposing side including a second patterned conductive layer with a heatsink plate receiving pad onto which the heatsink plate mounts. The heatsink plate has one or more posts that project from a mounting surface of the heatsink plate, and when the heatsink plate is mounted to the heatsink plate receiving pad, each post extends from the second side of the PCB, through a matching hole in the PCB, and to an associated thermal pad located on the first side of the PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.