Heat extraction system for a computing equipment enclosure
US11089720B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2020 |
| Grant date | Aug 10, 2021 |
| Priority date | — |
| Expiry date | Feb 18, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20827
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat extraction system for an enclosure comprises heat pipes having an evaporating reference temperature and a condensing reference temperature lower than the evaporating reference temperature, an evaporator portion and a condenser portion. The heat extraction system includes a support frame adapted for connection to the enclosure. The support frame is arranged with respect to the heat pipes such that, when the support frame is connected to the enclosure, the evaporator portion is thermally coupled to the at least one computer and the condenser portion is thermally coupled to a surrounding environment of the enclosure. The heat pipes are arranged with respect to the enclosure so as to transfer thermal energy from the enclosure to the surrounding environment when an interior temperature of the enclosure is greater than the evaporating reference temperature and an exterior temperature of the surrounding environment is less than the condensing reference temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.