Silicone and polymer substrate composite materials, methods, and uses of the same
US11090914B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2015 |
| Grant date | Aug 17, 2021 |
| Priority date | — |
| Expiry date | Jul 20, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Composite materials and methods of producing the same are provided. In some embodiments, the composite materials can comprise a polymer substrate, an intermediary material, such as a metal or oxide, mechanically attached onto the polymer substrate, and an elastomer bonded to the polymer substrate on the side of the polymer substrate comprising the intermediary materials. The elastomer can be bonded to the polymer substrate irreversibly, where the elastomer and the polymer substrate cannot be separated at their interface without breaking either the elastomer or the polymer substrate. In some embodiments, a primer and/or an epoxy can also be used. Uses of material sputtering or sputtered materials are also provided to bond a parylene substrate and silicone elastomer, or to enhance the relative strength of the bonding between the two. In addition, composite materials, and the use thereof, involving a parylene substrate, an elastomer receptacle, and liquid silicone are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.