Solder mask inkjet inks for manufacturing printed circuit boards
US11091659B2 · kind B2 · utility
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14Claims
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Key dates
| Filing date | Nov 7, 2017 |
| Grant date | Aug 17, 2021 |
| Priority date | — |
| Expiry date | Nov 20, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/125
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An inkjet method for producing a solder mask in the manufacture of a Printed Circuit Board uses a solder mask inkjet ink containing at least one photo-initiator, at least one free radical polymerizable compound and at least one RAFT compound as adhesion promoter. A high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties is produced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.