Etching composition, method for forming pattern and method for manufacturing a display device using the same
US11091694B2 · kind B2 · utility
3Cited by
3References
20Claims
0Family size
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Key dates
| Filing date | Sep 23, 2019 |
| Grant date | Aug 17, 2021 |
| Priority date | — |
| Expiry date | Sep 23, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/231
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An etching composition includes an inorganic acid compound, a carboxylic acid compound, a sulfonic acid compound, a glycol compound, a nitrogen-containing dicarbonyl compound, a sulfate compound and water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.