Photonic sensor chip, packaged photonic sensor device and arrangement

US11092742B2 · kind B2 · utility

Assignee

• IHP GMBH—INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS / LEIBNIZ-INSTITUT FÜR INNOVATIVE MIKROELEKTRONIK · DE

Inventors

• Patrick Steglich · Berlin, DE
• Andreas Mai · Guben, DE
• Christian Mai · Großostheim, DE

Key dates

• Filing date: Dec 18, 2019
• Grant date: Aug 17, 2021
• Expiry date: Dec 18, 2039

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B2006/12138
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

The invention relates to a photonic sensor chip comprising a semiconductor substrate with a cavity extending from a back side through an entire depth of the semiconductor substrate, a photonic plane located on the front side of the semiconductor substrate. The chip includes a photonic particle sensor element with an active-surface element having an exposed active surface facing towards the back side of the semiconductor substrate, for capturing selected particles from at least one fluid or gas to which the active surface is exposable. The cavity provides access to the active surface from the back side. The photonic particle sensor element receives an optical input wave via the photonic plane, to expose captured particles on the active-surface element to interaction with the optical input wave and to provide a resulting optical output wave having a spectral component indicative of the interaction between the optical input wave and captured particles.