Manufacturing methods of semiconductor devices
US11092885B2 · kind B2 · utility
0Cited by
9References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 10, 2020 |
| Grant date | Aug 17, 2021 |
| Priority date | — |
| Expiry date | Apr 10, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2119/06
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a semiconductor device includes randomly placing a plurality of standard cells from a library in which the standard cells are pre-stored, designing an interconnection pattern in which the standard cells are connected randomly to each other, connecting the standard cells according to the interconnection pattern to generate a virtual layout, performing an optical proximity correction operation on the virtual layout using an optical proximity correction (OPC) model, and forming and verifying a mask corresponding to the virtual layout on which the optical proximity correction operation is performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.