Peeling solution composition for dry film resist
US11092895B2 · kind B2 · utility
0Cited by
8References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2019 |
| Grant date | Aug 17, 2021 |
| Priority date | — |
| Expiry date | Apr 16, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D11/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to a peeling solution composition for dry film resist, which is usable for manufacturing a PCB for forming a microcircuit, and particularly is applicable for a process of manufacturing a flexible multi-layer PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.