Electronic component with external electrodes including conductive resin layer
US11094465B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2019 |
| Grant date | Aug 17, 2021 |
| Priority date | — |
| Expiry date | May 23, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/12
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An element body of a rectangular parallelepiped shape includes a principal surface arranged to constitute a mounting surface, a pair of side surfaces opposing each other and adjacent to the principal surface, and a pair of end surfaces opposing each other and adjacent to the principal surface and the pair of side surfaces. An external electrode includes a sintered metal layer disposed on an end portion of the element body, and a conductive resin layer including a portion positioned on the principal surface and a portion positioned on the sintered metal layer. An end edge of the sintered metal layer is positioned closer to the end surface than a maximum thickness position of the portion positioned on the principal surface. A thickness of the conductive resin layer gradually decreases from the maximum thickness position to the portion positioned on the sintered metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.