Use of noble metals in the formation of conductive connectors
US11094587B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2015 |
| Grant date | Aug 17, 2021 |
| Priority date | — |
| Expiry date | Jun 3, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/5226
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one embodiment, a conductive connector for a microelectronic component may be formed with a noble metal layer, acting as an adhesion/wetting layer, disposed between a barrier liner and a conductive fill material. In a further embodiment, the conductive connector may have a noble metal conductive fill material disposed directly on the barrier liner. The use of a noble metal as an adhesion/wetting layer or as a conductive fill material may improve gapfill and adhesion, which may result in the conductive connector being substantially free of voids, thereby improving the electrical performance of the conductive connector relative to conductive connectors without a noble metal as the adhesion/wetting layer or the conductive fill material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.