Power switching modular element and dismountable assembly of a plurality of modular elements
US11094618B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 29, 2019 |
| Grant date | Aug 17, 2021 |
| Priority date | — |
| Expiry date | Mar 29, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/92242
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a modular element (2) comprising a stratification of first and second electroconductive plates (PH2, PB2) which are separated by an intermediate dielectric layer (CD2) and at least one electronic power switching chip (CP1, CP2) which is implanted between the first and second plates, the chip having a upper face comprising a first power electrode and a switching control electrode and a lower face comprising a second power electrode, and the first and second power electrodes being in electrical continuity respectively with the first and second plates. According to the invention, the modular element comprises a plurality of openings (OG2, OA2, OB2, OC2, OD2) extending into the stratification from outer surfaces of the first and second plates and perpendicularly to said outer surfaces, the plurality of openings comprising at least one first opening (OG2) communicating with the switching control electrode and at least one second opening (OA2, OB2) passing through the entire stratification, the first and second openings each comprising a dielectric layer (DE2) and an electroconductive layer (CI2), and the electroconductive layer of the first opening being electri…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.