Substrate, electronic substrate, and method for producing electronic substrate
US11094658B2 · kind B2 · utility
0Cited by
2References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2019 |
| Grant date | Aug 17, 2021 |
| Priority date | — |
| Expiry date | Feb 7, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate is capable of effectively reinforcing a connecting portion between an electronic component and the substrate. The substrate is a substrate on which a first electronic component having a plurality of bumps is to be mounted, and includes a base portion including an insulator and having, on the upper face thereof, at least one groove portion configured to store a tip portion of at least one of the bumps, and includes an electrode formed on at least the bottom face of the groove portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.