Method of producing light-emitting diode chips and light-emitting diode chip

US11094845B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Massimo Drago · Riedenburg, DE
• Alexander Frey · Lappersdorf, DE
• Joachim Hertkorn · Neukirchen, DE

Key dates

• Filing date: Mar 15, 2018
• Grant date: Aug 17, 2021
• Expiry date: Mar 15, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/882

Abstract

A method of producing light-emitting diode chips includes A) and C)-F) in order: A) providing a growth substrate, C) producing a structural layer, the structural layer including Alx1Ga1-x1-y1Iny1N, where-in y1≥0.5, and a plurality of structural elements with a mean height of at least 50 nm so that a side of the structural layer facing away from the growth substrate is rough, D) producing a cover layer on the structural layer, the cover layer forming the structural layer true to shape and including Alx2Ga1-x2-y2Iny2N, wherein x2≥0.6, E) producing a planarization layer on the cover layer, a side of the finished planarization layer is flat and the planarization layer includes Alx3Ga1-x3-y3Iny3N, wherein x3+y3≤0.2, and F) growing a functional layer sequence that generates radiation on the planarization layer.