Methods for manufacturing ultrasound transducers and other components
US11094875B2 · kind B2 · utility
0Cited by
200References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 20, 2018 |
| Grant date | Aug 17, 2021 |
| Priority date | — |
| Expiry date | Aug 17, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/072
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The disclosed technology features methods for the manufacture of electrical components such as ultrasound transducers. In particular, the disclosed technology provides methods of patterning electrodes, e.g. in the connection of an ultrasound transducer to an electrical circuit; methods of depositing metal on surfaces; and methods of making integrated matching layers for an ultrasound transducer. The disclosed technology also features ultrasound transducers produced by the methods described herein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.