Patent · US Active

Compact semiconductor chip system and method

US11096284B2 · kind B2 · utility

0Cited by

0References

16Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Wee Hoe · Bayan Lepas, MY
Chan Kim Lee · Bayan Lepas, MY
Chee Chun Yee · Teluk Tempoyak, MY
Mooi Ling Chang · Bayan Lepas, MY
Siang Yeong Tan · Bayan Lepas, MY
Say Thong Tony Tan · Air Itam, MY

Key dates

Filing date	Jun 25, 2019
Grant date	Aug 17, 2021
Priority date	—
Expiry date	Jun 25, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10545
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A semiconductor device and associated methods are disclosed. In one example, a processor die is coupled to a first side of a package substrate, and a memory die coupled to a second side of the package substrate. A system accelerator die is further coupled to the package substrate. In selected examples, the system accelerator die provides performance improvements, such as higher cached memory speed and/or higher memory bandwidth.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.