Heat dissipation apparatus with fan
US11096312B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 4, 2020 |
| Grant date | Aug 17, 2021 |
| Priority date | — |
| Expiry date | Jun 4, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/3672
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat dissipation apparatus includes a heat sink unit, a flow guiding structure and a fan. In addition, the heat sink unit includes a base and a fin set arranged on the base. The flow guiding structure includes an air shield and an engagement frame arranged at one end of the air shield. The air shield includes an enclosure space formed at an internal thereof. The enclosure space includes an opening formed at two ends of the air shield respectively, and the air shield covers an exterior of the fin set with the enclosure space. The engagement frame is selectively arranged at an exterior of any one of the openings of the air shield; and a fan is arranged on the engagement frame.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.