Heat sink, heat sink arrangement and module for liquid immersion cooling
US11096313B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 6, 2018 |
| Grant date | Aug 17, 2021 |
| Priority date | — |
| Expiry date | Sep 6, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20272
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; and a retaining wall extending from the base and defining a volume. A heat sink may have a wall arrangement to define a volume, in which the electronic device is mounted. A heat sink may be for an electronic device to be mounted on a surface in a container, in an orientation that is substantially perpendicular to a floor of the container. Heat is transferred from the electronic device to liquid coolant held in the heat sink volume. A cooling module comprising a heat sink is also provided. A nozzle arrangement may direct liquid coolant to a base of the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.