Foam heating system
US11097493B2 · kind B2 · utility
0Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 19, 2020 |
| Grant date | Aug 24, 2021 |
| Priority date | — |
| Expiry date | May 19, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2307/5825
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A foam assembly system is provided. The system is configured to heat a surface of foam. After the heating of the foam, an adhesive is applied, typically a high solids adhesive. The foam is then bonded to another foam surface. It has been found that the pre-heating of the foam before adhesive application greatly enhances the bond strength between the foam and the second foam surface to which it is adhered.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.