Thermal printhead and method of manufacturing the same
US11097554B2 · kind B2 · utility
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1References
16Claims
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Key dates
| Filing date | Jun 24, 2020 |
| Grant date | Aug 24, 2021 |
| Priority date | — |
| Expiry date | Jun 24, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/34
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A thermal printhead includes a substrate, a protrusion formed on an obverse surface of the substrate and extending in a main scanning direction, a heat storage layer formed on a top surface of the protrusion, and a plurality of heat-generating parts arranged along the main scanning direction on the heat storage layer. The substrate and the protrusion are integrally formed from a single-crystal semiconductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.