Bent substrate provided with print layer, and method for manufacturing same
US11097978B2 · kind B2 · utility
4Cited by
3References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2018 |
| Grant date | Aug 24, 2021 |
| Priority date | — |
| Expiry date | Jun 28, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC03C2218/34
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for manufacturing a bent substrate, having a masking step of forming a masking member (M) on a bent substrate (10) and forming a predetermined pattern, and a printing step of forming a print layer (P) on a surface to be printed of the bent substrate (10) including the masking member (M). It is thereby possible to perform printing on a bent substrate having a curved surface part in a productive manner and at a high printing accuracy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.