Resin composition and resin molded body
US11098189B2 · kind B2 · utility
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Key dates
| Filing date | Jan 22, 2019 |
| Grant date | Aug 24, 2021 |
| Priority date | — |
| Expiry date | Jan 22, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2201/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition includes an acrylonitrile-butadiene-styrene resin (A), a polyethylene terephthalate resin (B), a condensed phosphoric acid ester-based flame retardant (C), and a thermally expandable graphite (D).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.