Patent · US Active

Solder mask inkjet inks for manufacturing printed circuit boards

US11098215B2 · kind B2 · utility

0Cited by

3References

15Claims

0Family size

Assignees

Agfa-Gevaert NV · BE
Electra Polymer Ltd. · GB

Inventors

Rita Torfs · Mortsel, BE
Hubertus Van Aert · Pulderbos, BE
Johan Loccufier · Zwijnaarde, BE
Marion Sauvageot · Mortsel, BE

Key dates

Filing date	Nov 7, 2017
Grant date	Aug 24, 2021
Priority date	—
Expiry date	Feb 15, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/013
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

An inkjet method for producing a solder mask in the manufacture of a Printed Circuit Board uses a solder mask inkjet ink containing a polymerizable adhesion promoter and a phenolic compound including at least two phenolic groups. A high quality solder mask withstanding the high thermal stress during the soldering process while maintaining excellent physical properties is produced.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.