Resin composition and use thereof
US11098229B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2017 |
| Grant date | Aug 24, 2021 |
| Priority date | — |
| Expiry date | Jul 27, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2207/32
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resin composition contains a polymer whose enthalpy of fusion (ΔH) observed within a temperature range of 10° C. or higher and lower than 60° C. in differential scanning calorimetry is 30 J/g or more; and a low-molecular-weight compound whose enthalpy of fusion (ΔH) observed within a temperature range of 0° C. or higher and lower than 100° C. in differential scanning calorimetry is 30 J/g or more and whose molecular weight is 2000 or lower. A content of the low-molecular-weight compound is 3 parts by weight to 1000 parts by weight with respect to 100 parts by weight of the total amount of polymer components contained in the resin composition except the low-molecular-weight compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.