Method for no-silane electroless metal deposition using high adhesive catalyst and product therefrom
US11098407B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2019 |
| Grant date | Aug 24, 2021 |
| Priority date | — |
| Expiry date | Jan 7, 2040 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/38
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method for electroless metal deposition and an electroless metal layer included substrate are provided. The method for electroless metal deposition includes steps as follows. a) cleaning a substrate, applying a hydrofluoric acid onto the substrate; and then applying a modifying agent onto the substrate to form a chemical oxide layer on the substrate; b) a catalyst layer is formed on the chemical oxide layer, wherein, the catalyst layer includes a plurality of colloidal nanoparticles, and each of the plurality of colloidal nanoparticles includes a palladium nanoparticle and a polymer which encapsulates the palladium nanoparticle, and c) depositing a metal on the catalyst layer through an electroless metal deposition to form an electroless metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.