Acoustic sensor with temperature structure
US11099078B1 · kind B1 · utility
11Cited by
1References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2018 |
| Grant date | Aug 24, 2021 |
| Priority date | — |
| Expiry date | Aug 4, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An acoustic sensor has a MEMS die with MEMS structure. Among other things, the MEMS structure includes a diaphragm configured to mechanically respond to incident acoustic signals, and a temperature sensor member configured to detect temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.