Patent · US Active

Wafer-scale membrane release laminates, devices and processes

US11101158B1 · kind B1 · utility

2Cited by

2References

8Claims

0Family size

Assignee

United States of America as represented by the Administrator of NASA · US

Inventors

Ari D. Brown · Ellicott City, US
Joseph Oxborrow · Glen Burnie, US
Vilem Mikula · Hyattsville, US
Kevin L. Denis · Beverly Farms, US
Timothy Mark Miller · New Providence, US

Key dates

Filing date	Aug 8, 2018
Grant date	Aug 24, 2021
Priority date	—
Expiry date	Sep 1, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2221/68381
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The disclosed subject matter relates to techniques, laminates and devices used to fabricate thin dielectric or semiconductor membranes including a handling substrate including a photoresist material on a first surface thereof, a semiconductor wafer having a circuit pattern on a first surface and a second surface to be processed and a temporary adhesive layer temporarily bonding the first surface of the semiconductor wafer to the first surface of the handling substrate including the photoresist material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.