Imaging element, method for manufacturing imaging element, and electronic device
US11101309B2 · kind B2 · utility
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1References
15Claims
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Assignee
Inventor
Key dates
| Filing date | Sep 19, 2018 |
| Grant date | Aug 24, 2021 |
| Priority date | — |
| Expiry date | Sep 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/804
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A photoelectric conversion unit that outputs an image signal according to received light and a bonding pad section are disposed on one surface side of the substrate, and the bonding pad section has at least: a first opening provided to expose a pad electrode at a bottom; and a second opening that is arranged to surround the first opening and that is shallower than the first opening. The surface of a terrace in the bonding pad section is formed such that multiple types of materials are exposed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.