Structures and methods for electrically connecting printed components
US11101417B2 · kind B2 · utility
4Cited by
69References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 6, 2019 |
| Grant date | Aug 24, 2021 |
| Priority date | — |
| Expiry date | Aug 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A printed structure includes a destination substrate comprising two or more contact pads disposed on or in a surface of the destination substrate, a component disposed on the surface, and two or more electrically conductive connection posts. Each of the connection posts extends from a common side of the component. Each of the connection posts is in electrical and physical contact with one of the contact pads. The component is tilted with respect to the surface of the destination substrate. Each of the connection posts has a flat distal surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.