Patent · US Active

Electrical component with heat dissipation

US11101784B2 · kind B2 · utility

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0References

12Claims

0Family size

Assignee

SnapTrack, Inc. · US

Inventors

Maximilian SCHIEK · Puchheim, DE
Bernhard Bader · Neubiberg, DE
Christian Ceranski · Munich, DE
Tomasz Jewula · Borgo San Lazzaro, DE

Key dates

Filing date	Nov 7, 2016
Grant date	Aug 24, 2021
Priority date	—
Expiry date	Jul 25, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH03H9/08
WIPO fieldBasic communication processes
WIPO sectorElectrical engineering

Abstract

In order to improve heat dissipation from electrical components with heat-generating component structures, it is proposed to provide a radiation layer with a large surface in the area of the component structures. Preferably, the radiation layer is very heat-conductive or in heat-conductive connection with the component structures.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.