Camera substrate assembly, camera module, and terminal device
US11102384B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 13, 2017 |
| Grant date | Aug 24, 2021 |
| Priority date | — |
| Expiry date | Jan 13, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/45
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A camera substrate assembly, a camera apparatus, and a terminal device, where the camera substrate assembly includes a rigid support plate and a printed circuit board laminated, where at least two mounting holes for accommodating camera chips are disposed on the printed circuit board, the rigid support plate has mounting surfaces facing the mounting holes respectively and are configured to support the camera chips, strength of the rigid support plate is greater than strength of the printed circuit board, and flatness of the mounting surfaces is less than a specified threshold. The mounting holes disposed on the printed circuit board and the mounting surfaces disposed on the rigid support plate are used to support cameras. This avoids impact of warpage on camera mounting when the printed circuit board and a flexible circuit board are laminated, and improves flatness after camera mounting.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.