Liquid immersion cooling platform
US11102912B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2018 |
| Grant date | Aug 24, 2021 |
| Priority date | — |
| Expiry date | Oct 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/2089
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using a pressure controlled vessel and pressure controller, the disclosed system may be operated at less than ambient pressure. By controlling the pressure at which the system operates, the user may influence the temperature at which the dielectric fluid vaporizes and thereby achieve increased performance from a given computer component. Utilizing robotic arms and slot-in computing components, a self-healing computing system may be created.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.