Method for bonding large modules, and bonding arrangement
US11103946B2 · kind B2 · utility
0Cited by
5References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 31, 2019 |
| Grant date | Aug 31, 2021 |
| Priority date | — |
| Expiry date | Apr 7, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/42
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for bonding large modules with the following steps, a large module is fed to a bonder from behind in a loading plane by means of a feeder unit. The large module is passed from the feeder unit to a first transverse conveyor unit, and is brought by the same to a first buffer position provided in the bonder, wherein the first buffer position is provided in a loading plane of the bonder. The large module is brought from the first buffer position into a first receiving position in the loading plane via the first transverse conveyor unit and is passed there to a vertical conveyor unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.