Flexible packaging material

US11104103B2 · kind B2 · utility

Assignee

• HP INDIGO B.V. · NL

Inventors

• Asaf Salant · Jerusalem, IL
• Raia Slivniak · Lod, IL
• David Idan · Nes Ziona, IL
• Limor Agmon · Nes Ziona, IL
• Einat Glick · Nes Ziona, IL

Key dates

• Filing date: Oct 23, 2015
• Grant date: Aug 31, 2021
• Expiry date: Jun 19, 2036

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B32B2553/00
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

Described herein is a process for preparing a flexible packaging material (6). The process may comprise: providing a base material (1) having a first surface (1a) and a second surface (1b), the first surface (1a) having an electrostatic ink composition (4) printed thereon; providing a sealant layer (3) on the second surface (1b) of the base material (1); providing a flexible substrate (4) on which a thermally activatable laminating layer (5) has been deposited; and contacting under conditions of heat and/or pressure the thermally activatable laminating layer (5) disposed on the flexible substrate (4) with the first surface (1a) of the base material (1) on which the electrostatic ink composition (4) is printed.