Composition, cured product and laminate
US11104788B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2017 |
| Grant date | Aug 31, 2021 |
| Priority date | — |
| Expiry date | Mar 9, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08J2463/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An object of the invention is to provide a composition having excellent heat resistance and excellent adhesiveness. Moreover, another object is to provide a cured product obtained by curing the composition and a laminate containing the cured product. Furthermore, another object is to provide a heat-resistant material, a heat-resistant member, an electronic material and an electronic member each containing the composition. The objects are achieved by providing a composition including: a (meth)allyl group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a (meth)allyl group and one or more groups having a maleimide group; and a hydroxy group-containing maleimide compound having a structure having one or more benzene rings, one or more groups having a hydroxy group and one or more maleimide groups.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.