Solventless silicone pressure sensitive adhesive and methods for making and using same
US11104828B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2018 |
| Grant date | Aug 31, 2021 |
| Priority date | — |
| Expiry date | Jun 29, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2483/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A solventless silicone pressure sensitive adhesive composition includes: (A) a polydiorganosiloxane having a monovalent hydrocarbon group with terminal aliphatic unsaturation, (B) a branched polyorganosiloxane having a monovalent hydrocarbon group with terminal aliphatic unsaturation, (C) a polyorganosilicate resin, (D) an olefinic reactive diluent, (E) a polyorganohydrogensiloxane, (F) a hydrosilylation reaction catalyst, and (G) an anchorage additive. This solventless silicone pressure sensitive adhesive composition can be cured to form a pressure sensitive adhesive. When cured on a backing substrate, the resulting adhesive article is useful for protecting electronic devices during fabrication, shipping, and use.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.