Non-contact measurement of a stress in a film on substrate
US11105611B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2018 |
| Grant date | Aug 31, 2021 |
| Priority date | — |
| Expiry date | Oct 24, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70883
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method and apparatus for non-contact measurement of stress in a thin-film deposited on a substrate is disclosed. The method may include positioning a substrate on a plurality of support-elements, the substrate having a thin-film deposited thereupon. A first-polynomial may be defined for representing a surface of the substrate that is in contact with the support elements. A second-polynomial may be determined based on an optimization determination of potential-energy acting upon the substrate. A finite-order polynomial may be created by calculating a product of the first and second polynomials to represent a shape of the surface of the substrate as a model of the surface. Thereafter, stress in the substrate may be determined based on fitting the model of the surface with a measured topographical data of the surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.